Simpex Technologies, Inc. has been providing a wide range of technical and engineering support services to the Semiconductor Industry and the Department of Defense since 1989. Simpex is centrally located in the midst of the Los Angeles freeway network, making access to various vendors readily available. Our facility is fully equipped to support the development of new manufacturing technologies and proof of design concepts which includes ND:YAG & Diode lasers, system & board based vision systems, microcircuit wire bond, pull & shear stations and various electronic analyzers. In addition, machine shops, raw materials, electronic component suppliers, computer accessory outlets, and special manufacturing process supports are all within 15 minutes distance.

 

This is one of Simpex’s latest innovative successes for a semi-automatic and a fully automated system capable of determining bond status of joined materials at the micro-scale.  The primary advantages of our technology include its non-contact and non-destructive nature, and its ability to perform tests at high speed (in nanoseconds) and high resolution (in microns). Quality validation is performed on the same side of the joined materials; no couplant or special preparation is necessary.  Typical applications include microelectronic wire bonds (including ultra fine-pitch bonds) and thin coating materials commonly used in the semiconductor industry.

Our system can characterize the full spectrum of bond status of joined materials (intermetallic structures) as well as detecting the presence of voids and surface fissures. Using our proprietary software, hardware and patented innovations, our system performs real time pass/fail analysis, 3D modeling and secured documentation via the computer network.