Simpex's Bond Detection System incorporates the latest Laser Ultrasonic Technology for determining bond integrity of materials at the micro-level. This Micro Technology combines a pulse laser and a continuous wave laser forming a cause-and-effect sensing device. Simply, the pulse laser sends multiple pulses of controlled light energy onto the object of interest (i.e. a microelectronic interconnect) causing a thermoelastic excitation response. This excitation induces an ultrasonic propagation (surface and bulk waves) on and through its neighboring materials. At close proximity, the continuous wave laser (detector) picks up the configuration and magnitude of these surface waves, which in turn, correlates to the bonding status of the joined materials. (View more detailed discussion of the Technology Concept)

Our System can characterize the full spectrum of bond status of joined materials (intermetallic structures) as well as detecting the presence of voids and surface fissures. Using our proprietary software, hardware, and patented innovations, our system performs real-time pass/fail analysis, 3D imaging, and secured documentation of test results via the computer network.

User Friendly Interface

Our Windows based Graphical User Interface (GUI) integrates all necessary hardware for the system, providing a very friendly and initiative operating environment for the end users. Our system runs in 5 different operating modes:

Calibration mode – system calibration and troubleshooting is performed under this mode.

Programming mode – supports the part pre-programming by stepping through the part to be tested. Programs can be modified (edit, add & delete) by authorized personnel only.

Computer assisted (Semi-automatic) mode - selective testing of materials by point and click using the mouse or pointing device. The test result, live image of test points and raw data can be saved for future review and evaluation.

Automatic mode – end user can perform production testing (multiple parts) with no operator intervention (other than loading and unloading new parts). Pass/fail analysis is performed automatically and documented in real-time. Statistics can be retrieved for process control. 

Data retrieval & analysis mode – review test results sorted by part number, customer, and by manufacturing machine are a few of the options. Enhanced graphics for presentation is included.       

Capabilities Summary

- Detect full spectrum of bond integrity of joined materials

- Line of sight detection, requiring 0.0005 inch access space

- Material characterization / Diagnostic tool

- Detect voids, cracks, and surface fissures

- Due to its non-contact and non-destructive nature, interconnects can be tested multiple times (such as before and after thermal aging) with no undesirable effect

Unique Benefits

- Non-contact, non-destructive, high speed (millionth of a second)

- Both pulse and detect is performed on the same side

- No couplant or special preparation of material is necessary

- Generic nature and is adaptable to broad spectrum of materials